Intel Corporation on February 26 announced that it will invest $1 billion to $1.5 billion in its Rio Rancho site to retool Fab 11X for production on Intel’s next-generation 45-nanometer (nm) manufacturing process. Fab 11X will be the company’s fourth factory scheduled to use the 45nm process, with production in
Marking one of the biggest advancements in fundamental transistor design in 40 years, Intel’s 45nm high-k and metal gate process consists of an innovative combination of new transistor materials that drastically reduces transistor leakage and increases performance. When 45nm production begins later this year, the company will use a new material with a higher-k (dielectric constant), and a new combination of metal materials for the transistor gate electrode. Extending its lead over the rest of the semiconductor industry, early versions of Intel’s next generation 45nm family of products – codenamed Penryn – are already running multiple operating systems and applications, and the company remains on track to begin 45nm production in the second half of this year.
“Our new 45-nanometer process represents one of the most significant manufacturing breakthroughs in decades and we believe that putting it in our factory in
“We have worked hard to make New Mexico a center for new technology and this announcement is $1 billion worth of proof that our efforts are working," said Governor Bill Richardson. "This investment sends the message that Intel New Mexico will be here for years to come, and will manufacture some of the most advanced technology in the world.”
“This decision by Intel to invest over $1 billion in its Rio Rancho facility is great news,” said Senator Pete Domenici. “Intel has been an outstanding corporate citizen in
Initial production of Intel’s 45nm products will be done at its
Fab 11X currently manufactures 90nm computer chips on 300mm wafers. Fab 11X began production in October 2002 and was Intel’s first 300-millimeter, or 12 inch, high-volume manufacturing facility. It was also Intel's first fully automated, high-volume factory producing 300mm wafers.